UV Curing

The Challenge

Improve yields during the process of adhesion reduction of dicing tape on silicon and III-V semiconductor wafers, including wafers processed to sub-100 micron thickness.

The Solution

The OmniCure® AC8 Series family of UV LED systems provides high irradiance, low heat UV light without ozone production
for efficient and high yield wafer tape adhesion reduction processes.

The Benefit

Increased profitability through improved yields, reduced operating costs and a more environmentally friendly UV process for wafer tape adhesion reduction.